A |  B |  CD |  E |  F | G |  H |  I |  J |  K |  L |  M |  N |  O |  P |  Q |  R |  S |  T | U V |  W | X | Y | Z


A

Acceptable Quality Level (AQL): The AQL of a sampling plan is a level of quality routinely accepted by the sampling plan. It is generally defined as that level of quality (percent defective, defects per hundred units, etc.) that the sampling plan will accept a set percentage of the time.

802.11: An evolving family of specifications for wireless local area networks (WLANs) developed by a working group of the Institute of Electrical and Electronics Engineers (IEEE). There are several specifications in the family and new ones are occasionally added.

ADSL : Asymmetic Digital Subscriber Line. A digital line that uses the existing twisted pair copper telephone network to achieve speeds of up to 6 megabits per second up to 12000 feet, or 1.5 megabits per second up to 18000 feet.

Advanced Encryption Standard (AES): is an encryption algorithm for securing sensitive but unclassified material by U.S. Government agencies and, as a likely consequence, may eventually become the de facto encryption standard for commercial transactions in the private sector. Encryption for the US military and other classified communications is handled by separate, secret algorithms.

Annular ring: The copper ring around the hole in a printed circuit board.

Application-Specific Integrated Circuit (ASIC): An ASIC is a "chip" designed for a special application, such as a particular kind of transmission protocol or a hand-held computer. You might contrast it with "general" integrated circuits, such as the microprocessor and the random access memory chips in your PC. ASICs are used in a wide-range of applications, including auto emission control, environmental monitoring, and personal digital assistants (PDAs).

Approved Manufacturer List (AML): A list of manufacturers specific to individual components or products that have been approved by the contracted manufacturer and/or customer. The referenced components or products can not be purchased from manufacturers not on the AML.

Approved vendor list (AVL): a listing of all approved sources, in addition to part descriptions and part numbers.

ASIC design: Ability to design an application specific integrated circuit (ASIC) chip. An ASIC chip is custom designed for a specific application, in contrast to a general-purpose chip such as a microprocessor.

Auto-Insertion (AI): A method/equipment used to produce pin-through-hole components to PC boards.


B

Ball-grid array (BGA): A method used to attach integrated circuits to a printed circuit board.

Bare Board: A finished PCB that has had no components added.

Bill of materials (BOM): a comprehensive listing of all components and subassemblies that go into a specific product, showing the quantity of each required to assemble the item.

Bluetooth:  A short range wireless technology that connects electronic devices, including cell phones, printers, digital cameras or palm top computers. Bluetooth is designed to exchange data at speeds up to 720kbit/s and at ranges up to 10 meters. Bluetooth, sometimes mis-spelled Blue Tooth, was named after the Danish king Harald Blåtand (Bluetooth) who unified Denmark and Norway. Fir additional information please go to http://www.bluetooth.com

Box-build: A term commonly used to describe assembly work other than printed circuit board (PCB) production. The electromechanical assembly process involves enclosure fabrication, installation of subassemblies and components, and routing of cabling or wire harnesses.

British Approval Board for Telecommunications (BABT): BABT certifies products and services in the fields of IT and telecom.

Build-to-order systems assembly: Build a unit from component level to an individual order, including required peripherals and software. Ship direct to customer.

Build-to-stock systems assembly: Build significant volume of units based on forecast, typically a base unit or standard configuration. Ship to either OEM warehouse or distribution warehouse.

Burn in (BI): A method used to screen out a component with early life failures.


C

CDMA (Code Division Multiple Access): Is the most common and most recent digital cellular technology in North America. What differentiate CDMA from other phone technologies is that in order to carry many conversations over one frequency, it sends all communications in groups of bits mixed altogether, but tags each group, belonging to a specific communication, with a different code (Therefore, at the other end, each communication can be reassembled in the correct order, based on the unique codes attached to certain groups of bits.

Central processing unit (CPU): An older term for processor and microprocessor, the central unit in a computer containing the logic circuitry that performs the instructions of a computer's programs.

Channel assembly: When the channel, such as distributors, dealers or VARs, perform BTO or CTO functions themselves or outsource the manufacturing function.

Chip-on-board (COB): A method of affixing an un-encapsulated chip onto a printed circuit board using a wire bonding process.

Circuit design: Ability to design the circuit logic that allows electronic components to perform a specific function.

Compact Flash: Introduced by Sandisk in 1994. One fourth the size of a PC card. 36 mm long, 43 mm wide and 3.3 mm thick. ATA interface. Uses 50 pins. Takes a passive adapter to use it in a PC card slot.

Compact PCI: Is a modern, very high performance and ruggedized industrial bus based on the standard PCI electrical specification.

Complex systems assembly: Ability to assemble and test systems that involve large scale assembly, integration, staging and product support; that require extensive testing and configuration; have high part counts/complex BOM management require engineering changes and accelerated testing (e.g. HASS, power cycling)

Component engineering: The service of applying engineering know-how to the processes of component selection, application and procurement. Can provide analysis of new trends in electronic devices.

Configure-to-order systems assembly: Takes an already built or partially built unit and adds specific peripherals and software for individual customer order. Ship direct to customer.

Contract manufacturer (CM): A company that engages in product assembly, engineering services, order fulfillment and product distribution. A CM usually works on behalf of an OEM. However, OEMs can also function as contract manufacturers.

Contract manufacturing: Production of products on behalf of an OEM, in which the design and brand name belongs to the OEM. Contract manufacturers have made it possible for some companies to operate without owning any brick-and-mortar factories. Price pressure and the need for global product expansion are driving the growth of contract manufacturing. Any contract manufacturer should provide an advantage that isn’t already part of the OEM’s infrastructure. Also see "electronics manufacturing services" and "outsourcing."

Core competencies: Activities or practices, such as product development, deemed by a company as critical to its long-term success and growth. Typically, core competencies are based on skills or knowledge sets rather than products or functions. They provide return on investment and act as a barrier for other companies trying to enter the market. Many manufacturers choose to focus on core competencies and outsource production tasks. Most OEMs plan to keep their high-level engineering and design work as internal competencies, particularly as they apply to new products and high-end products.

Corrective action request (CAR): An action item that surfaces whereby the requesting party (either the OEM or EMS provider) asks the party responsible to conduct a root cause analysis and resolve the issue identified.

Custom packaging: The ability to add accessory and FRU items, unique to the customer order, for end distribution. This could involve adding promotional items, country-specific kits for accessories including keyboards, power cords and literature, and shipping to the customer in a wide assortment of end-packaging requirements.

Customer relationship management (CRM): An information industry term for methodologies, software, and usually Internet capabilities that help an enterprise manage customer relationships in an organized way. For example, an enterprise might build a database about its customers that described relationships in sufficient detail so that management, salespeople, people providing service, and perhaps the customer directly could access information, match customer needs with product plans and offerings, remind customers of service requirements, know what other products a customer had purchased, and so forth.


D

Data Encryption Standard (DES): The algorithm specification was published in January 1977, and with the official backing of the government it became a very widely employed algorithm in a short amount of time. DES encrypts and decrypts data in 64-bit blocks, using a 64-bit key (although the effective key strength is only 56 bits, as explained below). It takes a 64-bit block of plaintext as input and outputs a 64-bit block of ciphertext. Since it always operates on blocks of equal size and it uses both permutations and substitutions in the algorithm, DES is both a block cipher and a product cipher. DES has 16 rounds, meaning the main algorithm is repeated 16 times to produce the ciphertext. It has been found that the number of rounds is exponentially proportional to the amount of time required to find a key using a brute-force attack. So as the number of rounds increases, the security of the algorithm increases exponentially.

Design for manufacturability (DFM): Is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction.

Design validation: Provides a process that subjects a design to a series of stress tests to determine its robustness

Design-for-X (DFX): The value-added service of instituting "best practices" in the design stage to improve X, where X is manufacturability, testability, serviceability, etc. DFX can include analysis of design documentation for production readiness and integrity, best selection of components for functionality, cost and availability, design for best manufacturing and assembly of PCBs and system, and design of best cost effective tests.

Dual In-Line Memory Module (DIMM): A small circuit board that holds memory chips. A single in-line memory module (SIMM) has a 32-bit path to the memory chips whereas a DIMM has 64-bit path. Because the Pentium processor requires a 64-bit path to memory, you need to install SIMMs two at a time. With DIMM's, you can install memory one DIMM at a time.

Dynamic Random Access Memory (DRAM:): A type of memory used in most personal computers.



E


ElectricStatic Discharge (ESD): Is one of the few things an individual can do to damage or destroy his or her computer or hardware components. Much like the shock you receive when rubbing your feet on the carpet and touching something metal, ESD can occur when working in your computer and will causes components you touch to no longer work properly. ESD can occur without the user feeling a shock and will only occur while working on the inside of the computer or handling an expansion card.

Electronic Data Interchange (EDI, E-business, E-commerce): The electronic transfer of data over a network.

Electronic Fund Transfer (EFT): Moving money by electronic means such as an ACH or wire.

Electronic Manufacturing Service (EMS): A manufacturer of products containing electrical components.

Electronics manufacturing services (EMS): An industry based on providing contract design, manufacturing and product support services on behalf of OEMs. Traditional services include PCB assembly, box-build and testing. Today, EMS providers are also providing numerous services such as supply chain management, global distribution, logistics, customer support and repair. However, all intellectual property belongs to the OEM. Also see "contract manufacturing" and "outsourcing."

Embedded solutions (communications, computers, industrial and consumer): A system that is located entirely on a processor. All logic is contained in a single chip.

EMV: Is an acronym for Europay, MasterCard and Visa. It refers to the "EMV Specification" which is the set of standards that the three payment organizations agreed in order to describe the inter action between a smart card and a terminal or ATM device for the purpose of secure card payment. In short it is a global standard for the design, security, and functionality of smart card terminals and applications.

End of life manufacturing (EOL): Generally involves the support of low volume new build to support service demand where the return rates from service do not support the service demand rate. Will involve BOM management, AVL management, material recovery, order management, manufacturing tool archives.

Engineering change order (ECO): An alteration made to an AVL or BOM, such as the replacement of one component by a substitute component. Any changes should be prepared, approved and incorporated promptly and correctly to minimize problems. Changes often vary in complexity and urgency, but can have a ripple effect. Any ECO should be documented on a blank form or template that contains key information, such as a description of change, a reason for the change, the type of change and the implementation date (e.g., immediate action or implement when possible).

Enhanced Messaging Service (EMS): Is an adaptation of the Short Message Service (SMS) that allows users to send and receive ring tones and operator logos, as well as combinations of simple media to and from EMS-compliant handsets. Because EMS is based on SMS, it can use SMS Centers (SMSCs) the same way that SMS does. EMS works on all Global System for Mobile communications (GSM) networks (widely used in Europe and increasingly available elsewhere). If a message is sent to a phone that is not EMS-capable, the recipient will still receive the text portion of the message. EMS is being actively promoted by Alcatel, Ericsson, Motorola, and Siemens. Nokia is promoting a similar proprietary standard called "Smart Messaging."

Enterprise Resource Planning (ERP): A packaged application that enables a company to automate almost every aspect of its operations by tying its ERP databases to its intranet and extranet and allowing full browser access to them.

Environmental stress screening: A process by which components or assemblies are tested at the extremes of their normal operating conditions, usually in terms of temperature and voltage limits, for a period of hours or days in order to detect early life defects. It is not meant to be a destructive test.

Ethernet: is the most widely-installed local area network (LAN) technology. Specified in a standard, IEEE 802.3, Ethernet was originally developed by Xerox from an earlier specification called Alohanet (for the Palo Alto Research Center Aloha network) and then developed further by Xerox, DEC, and Intel. An Ethernet LAN typically uses coaxial cable or special grades of twisted pair wires. Ethernet is also used in wireless LANs. The most commonly installed Ethernet systems are called 10BASE-T and provide transmission speeds up to 10 Mbps. Devices are connected to the cable and compete for access using a Carrier Sense Multiple Access with Collision Detection (CSMA/CD) protocol.

Extended Data Out DRAM (EDO DRAM): A DRAM that holds the data on the system memory bus until the beginning of the next cycle. Named to distinguish it from FPM DRAM which removes the data from the memory bus before the completion of the cycle.


F

Field-Programmable Gate Array (FPGA): Is a technology for making integrated circuits. The key difference from other chip technologies is that it is field programmable, meaning that you get to make the chip do what you want without having to get an external manufacturer. This means much less risk because if you make a mistake you do not have to wait for weeks to get another chip made, and you do not have to spend a lot of money to make the fix. All you do is modify your design and re-program your chip, much like you fix a C program, recompile it, load it into memory, and run it.

First-In, First-Out (FIFO) : Is an inventory cost flow whereby the first goods purchased are assumed to be the first goods sold so that the ending inventory consists of the most recently purchased goods.

First-pass yield (FPY): The percentage of product tested that passed inspection on first attempt.

Flash memory technologies: Non-volatile semiconductor ICs. They are derivatives of EPROM an EEPROM technologies. The architecture of flash chips is based on the idea that it will be seldom written to but will be read often. Rapidly replacing the other non-volatile memory types (ROM, EPROM & EEPROM) in many applications

Flexible circuit assembly: Second-level integration of active and or passive devices on a flexible, formable substrate.

Free on Board (FOB): Is a mercantile expression used in sale contracts denoting that goods have to be delivered by the shippers on board the vessel at a particular place, free of charge.

Fulfillment: A process that supplies a finished manufactured product directly from a manufacturing facility to a distributor or end user without the finished product going back through the company that has created the product. The fulfillment cycle may include receiving customer orders, configuring the products to order, shipping and invoicing products to distribution outlets or end users around the world.


G

Gerber Data: A type of data that consists of graphics commands, usually describing how to draw a picture of a circuit. Intended for directing a photo plotter, it is the most common format for data transfer from PCB CAD systems to the manufacturing process. Gerber data is officially designated as RS-274-D (without embedded aperture codes) and RS-274-X (with embedded aperture codes).

Global Systems for Mobile communications (GSM): One of the leading digital cellular systems. GSM uses narrowband TDMA, which allows eight simultaneous calls on the same radio frequency.

GPRS (General Packet Radio Service): A packet switching technology for GSM networks. It's an advanced data transmission mode that does not require a continuous connection to the Internet, as with a standard home modem. Instead, GPRS uses the network only when there is data to be sent, which is more efficient. The "GSM Association" believes using GPRS will enable users to send and receive data at speeds up to 115 kbps, more than two times faster than with traditional home modems.

GSM (Global System for Mobile Communications): Technically, GSM was built based on the TDMA protocol. Considered the most advanced digital cellular technology, extremely popular in Europe and Asia. GSM networks are leaders in many typically "digital" services including the Short Message Service (SMS), Over the air (OTA) configuration and GSM positioning. Considered its technology and presence both in Americas and the rest of the world, GSM is in a good position for global roaming and many new GSM phones are called "global phones", since they can be used in virtually any country. The SIM card ("Subscriber Identification Module") is also a unique and essential component of GSM phones.

Graphical User Interface (GUI): Refers to the techniques involved in using window graphics, along with the keyboard and the mouse, to provide an easy to use interface to programs.


H


High-mix, low-volume: A contract manufacturing environment where the products being assembled vary in application, lot size and production processes. Contract manufacturers that are equipped for high-mix, low-volume production have the ability to change over product requirements and convert assembly lines in a matter of hours. They can easily add capacity to accommodate increased volume and rapid throughput cycles. However, high-mix, low-volume manufacturing creates numerous challenges because there are more areas to invite error. Lower quantities demand more frequent changeover and may only last several shifts or days.

กก

HSCSD (High Speed Circuit Switched Data): One of the standards for high-speed data over GSM type of mobile phones. HSCSD establishes a permanent connection to the data network, which makes it more suitable for applications such as video-conferencing than GPRS, another high speed data technology. HSCSD delivers speeds of 38.4 to 57.6 Kbps, slightly more than what can be achieved with a regular fixed telephone system modem.

HSP: Host signal processing

 

I

Incoming Quality Control (IQC): Is the first stop gate in manufacturing to prevent inferior parts from being passed to production.

Industry Standard Architecture (ISA): Older standard also used to be commonly used in PC’s.

Infrared Data Association (IrDA): An industry-sponsored organization set up in 1993 to create international standards for the hardware and software used in infrared communication links. In this special form of radio transmission, a focused ray of light in the infrared frequency spectrum, measured in terahertz, or trillions of hertz (cycles per second), is modulated with information and sent from a transmitter to a receiver over a relatively short distance. Infrared radiation (IR) is the same technology used to control a TV set with a remote control. Infrared data communication is playing an important role in wireless data communication due to the popularity of laptop computers, personal digital assistants (PDAs), digital cameras, mobile telephones, pagers, and other devices.

In-process inspection (IPI): A built-in inspection function in the manufacturing process

InProcess Quality Control (IPQC): Generally there are two methods of in-process quality. One is to setup a gate for inspection and sort out defective products. The second is control on the process. In most cases a combination of the two methods is used.

Input/Output (I/O) devices: Devices whose purpose is to enter data into a computer or to extract data from a computer. For example, a modem is an I/O device, whereas a CPU is a computational device.

Integrated circuit (IC): sometimes called a chip or microchip, is a semiconductor wafer on which thousands or millions of tiny resistors, capacitors, and transistors are fabricated. An IC can function as an amplifier, oscillator, timer, counter, computer memory, or microprocessor. A particular IC is categorized as either linear (analog) or digital, depending on its intended application.

Integrated Services Digital Network (ISDN): An international communications standard for sending voice, video, and data over digital telephone lines or normal telephone wires. ISDN supports data transfer rates of 64 Kbps (64,000 bits per second). Most ISDN lines offered by telephone companies give you two lines at once, called B channels. You can use one line for voice and the other for data, or you can use both lines for data to give you data rates of 128 Kbps, three times the data rate provided by today's fastest modems.

Intellectual property (IP): Any product of the human intellect that is unique, novel and unobvious, and has some value in the marketplace. It includes ideas, inventions, business methods and manufacturing processes.

Interconnection and packaging consulting: Service of assisting or advising customers in the areas of: selecting the appropriate packaging and materials, design tradeoffs in board wiring and spacing densities, and determining internal wiring and components usage based on performance, reliability, manufacturing and cost considerations.

IPC: Association Connecting Electronics Industries. IPC is an electronic interconnect organization that brings together all industry players, including designers, board manufacturers, assembly companies, suppliers, and original equipment manufacturers. http://www.ipc.org/


J

Java: A programming language expressly designed for use in the distributed environment of the Internet. It was designed to have the "look and feel" of the C++ language, but it is simpler to use than C++ and enforces an object-oriented programming model. Java can be used to create complete applications that may run on a single computer or be distributed among servers and clients in a network. It can also be used to build a small application module or applet for use as part of a Web page. Applets make it possible for a Web page user to interact with the page.

Joint design manufacturer (JDM): A company that helps design products for OEM customers. However, distinction on who owns the intellectual property is murky and can surface as licensing problems.

Joint service agreement (JSA): A document used in conjunction with a contract to define the processes, performance targets and expectations of both an OEM and a contract manufacturer. The joint service agreement should be specific in terms of how the work will be done and evaluated. It should be supplemented by a management control system that requires a regular review of performance against the JSA expectations. This approach helps minimize the misunderstandings that often develop in outsourcing relationships. Also see "manufacturing and supply agreement."

Just in time (JIT) manufacturing (kanban): The material handling practice that minimizes or eliminates the amount of product brought into inventory by setting up a delivery schedule that brings materials directly from the supplier to the production floor.


K


Kiosk: Is a small physical structure often including a computer and a display screen that displays information for people walking by.

Kitting: Gathering parts into kits for production assembly.


L

 

LabView: Is the graphical development environment for creating flexible and scalable test, measurement, and control applications rapidly. With LabVIEW, engineers and scientists can interface with real-world signals, analyze data for meaningful information, and share results and applications.

Landline connections: Landline is a term used by wireless system operators to refer to the regular telephone network. Sometimes called the wired network, but because the wireline cellular phone usually operates the wired phone network, the term landline is preferred.

Letter of Credit (LOC): A form of payment, used especially in international trade, that transfers funds from the buyer’s bank account to the seller’s bank account. An Irrevocable Letter of Credit cannot be cancelled or revoked by the buyer as long as all documents are proper and approved by the bank and the goods have been delivered to the specified place for shipment to the buyer.Liquid crystal display (LCD): The technology used for displays in notebook and other smaller computers. Like light-emitting diode (LED) and gas-plasma technologies, LCDs allow displays to be much thinner than cathode ray tube (CRT) technology. LCDs consume much less power than LED and gas-display displays because they work on the principle of blocking light rather than emitting it.

Logistics and distribution management: Logistics involves the sorting, warehousing and shipping of raw goods and finished product. Distribution management focuses on direct shipments to the end user.

Logistics management: Manages the reverse flow of defective product from the end user through the various steps to repair and then back out to the end user. Will involve inventory management, remote stocking location management/re-provision, reverse logistics, advanced exchange, warehousing, external shipping/receiving, freight carrier management, scheduling, forecasting, import/export, freight data collection, and turnaround time metrics.

Low-mix, high-volume: A contract manufacturing environment where there are a few number of assemblies produced in large quantities. High-volume production may last for weeks or months using the same setup. Changeover is at a minimum and equipment utilization is very high. Contract manufacturers are at their most efficient when running at high volumes, with minimal engineering changes.


M

Manufacturing and supply agreement (MSA): A contract that defines responsibilities and bridges the relationship between an OEM and a contract manufacturer. It outlines what the EMS provider is required to do for the OEM and at what "cost" to the provider. It also details what the OEM will receive from the provider and at what "price." An MSA addresses pricing for both current and new products, inventory liability, and performance and service expectations. Also see "joint service agreement."

Manufacturing and technology roadmap: Providing a strategic outline of what manufacturing and technology methods, machines and process will be used.

Materials requirement planning (MRP): Original manufacturing business software that focuses only on planning the manufacturing materials and inventories and does not integrate planning for other resources, like people or machine capacity.

MD5: An algorithm that is used to verify data integrity through the creation of a 128-bit message digest from data input (which may be a message of any length) that is claimed to be as unique to that specific data as a fingerprint is to the specific individual. MD5, which was developed by Professor Ronald L. Rivest of MIT, is intended for use with digital signature applications, which require that large files must be compressed by a secure method before being encrypted with a secret key, under a public key cryptosystem. MD5 is currently a standard, Internet Engineering Task Force (IETF)

Mechanical design: Ability to do physical designs that accomplish a specific function through the work of electronic subassemblies and mechanical parts and sub-assemblies. Gears, sheet metal, and plastic parts are some of the mechanical components. Power supplies, PCB assemblies, fans are some of the mechanical sub-assemblies.

Medium-mix, medium-volume: A contract manufacturing environment where production volumes remain relatively stable for an extended period of time. Medium-volume production may last for days or weeks using the same setup.

Memory cards: Memory sub-system in the PC card (PCMCIA) or other form factors used for memory capacity expansion.

Memory modules: A self-contained modular memory sub-system to is used to configure or upgrade computers and other electronic systems.

Mini PCI: Standard that covers modem and multi-function expansion cards for use primarily in notebooks and other portable devices.

Minimum Order Quantity (MOQ): The minimum amount of which a part or product can be ordered.

Minimum Purchase Quantity (MPQ): The minimum amount of which a part or product can be purchased.

MIPS: Million Instructions Per Second: This is a rating of how quickly a processor can process instructions. A processor rated at 100 MIPS can process 100,000,000 instructions per second.

Modem: A device that converts data from one form to another, as from a digital computer to a telepone.

Multilayer Board: A PCB having one or more inner layers in addition to the outer layers. The inner layers are bonded to the outer layers.


N


New product introduction (NPI): A set of integrated processes used to convert a product design into a manufacturing-ready product while meeting cost, quality and time-to-market objectives.

New Product Introduction management (NPI): Provides a business process to help the customer achieve a cost-effective quick-to-volume production design. The process is most effective when the customer engages at the concept phase of the product's development cycle. It can include technology selection, design, test and material strategies, DFX, component, design and development engineer services and rapid board and system proto build services.

Nonrecurring expense (NRE): Items and activities required by an EMS provider specific to a particular OEM’s product program, such as setup, tooling and programming. These one-time charges are separate from the product cost.

One Time Programmable Read-Only Memory (OTPROM, EPROM OTP): A kind of storage device like an EPROM but with no quartz glass window in the package for erasing the contents. This reduces the packaging cost but means the device cannot be erased with UV and so can only be written once. Erasure is possible, but expensive, with X-rays.

 

O

Original design manufacturer (ODM): A company that manufactures products of its own designs, which are then sold under an OEM’s brand name. Typically, the ODM determines what products to build and the OEM simply purchases the items ready-to-go. Unlike an EMS provider, an ODM designs products based on its own intellectual property. More and more OEMs are considering the ODM model because it offers them a more complete turnkey solution, with less design and supply-chain interactions with the supplier.

Original equipment manufacturer (OEM): A company that designs and specifies products under its own company name and brand. Traditionally, OEMs design products, purchase components from suppliers, operate their own manufacturing plants, and handle sales, service and support activities, but many of those functions are being outsourced today

Outgoing Quality Control (OQC): The primary responsibility of OQC is to guarantee that each lot A17submitted meets internal specifications and customer requirements. OQC is important as it is last gate of internal quality control. After products passed OQC, products will be shipped out.

Outsourcing: The process of subcontracting a process, such as product design or manufacturing, to a third-party company. Outsourcing to EMS providers has traditionally appealed to makers of computers, telecommunications hardware and other electronic items. However, outsourcing also is becoming a cost-effective option for manufacturers of fiber optic components and medical devices. Many companies outsource older, more stable product lines so they can focus operations on newer, more technically complex products with higher profit margins. Also see "contract manufacturing" and "electronics manufacturing services."


P

Parts management: Serial number tracking, EC management, parts exchange, configuration management, FGI levels, secondary channel sales, parts sale/restocking, advanced sales, sub-contract repair management.

PC Cards: A computer device packaged in a small card about the size of a credit card and conforming to the PCMCIA standard.

Peripheral Component Interconnect (PCI): A local bus standard developed by Intel Corporation. Most modern PCs include a PCI bus in addition to a more general ISA expansion bus. Many analysts, however, believe that PCI will eventually supplant ISA entirely. PCI is also used on newer versions of the Macintosh computer.

Personal Identification Number (PIN): A number allocated to an individual and used to validate electronic transactions.

Pin-through-hole (PTH): A method of soldering electrical components to a board substrate that involves pin-through-hole connections

Point Of Sale (POS): Refers to activites taking place at the point of sale such as a cash register or kiosk.

Point Of Sale Activation (POSA): The procedure by which a sale is made at the merchant's location.

Printed Circuit Board (PCB)/ Printed Wiring Board (PWB): The generic term for completely processed printed circuit configurations. It includes rigid or flexible single, double, or multilayer boards. A substrate of epoxy glass , clad metal, or other material upon which a pattern of conductive traces is formed to interconnect components.

Printed circuit board assembly (PCBA): Second-level integration of active and passive devices (electrical, electronic, optical and/or mechanical) on a rigid substrate

Printed circuit board layout: The process of transforming the electrical design (functional or logical representation) into a physical object (physical layout of placing components and routing of interconnect wires.)

Printed circuit: A circuit for electronic apparatus made by depositing conductive material in continuous paths from terminal to terminal on an insulating surface.

Process development: Tailoring or building manufacturing methods for technology mix elected by customer.

Pull system: The production of items only as demanded for use, or to replace those taken for use. In a material control context, this is the withdrawal of inventory as demanded by using operations. Material is not issued until a signal comes from the user.

Pulse Code Modulation (PCM): A sampling technique for digitizing analog signals, especially audio signals. PCM is used with T-1 and T-3 carrier systems. These carrier systems combine the PCM signals from many lines and transmit them over a single cable or other medium.

Push system: The production of items that are, at times, required by a given schedule, planned in advance. In a material control context, it refers to the issuing of materials according to a given schedule and/or issuing to a job order and its start time.


Q

Quick-turn prototyping: Ability to produce a sample of a product in a relatively short time. For example, assembling a printed circuit board in 48 hours from receipt of all the board-level components.

 

R

Radio Frequency ID (RFID): Radio Frequency Identification is a means of capturing data about an object without using a human to read the data.

Radio Frquency (RF) and wireless design: Ability to do circuit designs that operate in a range of electromagnetic frequencies above the audio range and below visible light. All broadcast transmission, from AM radio to satellites, falls into this range, which is between 30KHz and 300GHz.

Rambus DRAM (RDRAM): A type of memory (DRAM) developed by Rambus, Inc. Whereas the fastest current memory technologies used by PCs (SDRAM) can deliver data at a maximum speed of about 100 MHz, RDRAM transfers data at up to 600 MHz.

Rambus In-line Memory Module (RIMM): This is the form factor for Rambus RDRAM. By comparison, SDRAM is mainly found on DIMM’s, and EDO RAM is usually on SIMMs. RIMM's require that if you do not fill all RIMM slots with RDRAM memory, you must keep the empty slots filled with termination boards to ensure that the high speed Rambus memory signals do not bounce improperly.

Random access memory (RAM): is the place in a computer where the operating system, application programs, and data in current use are kept so that they can be quickly reached by the computer's processor. RAM is much faster to read from and write to than the other kinds of storage in a computer, the hard disk, floppy disk, and CD-ROM. However, the data in RAM stays there only as long as your computer is running. When you turn the computer off, RAM loses its data. When you turn your computer on again, your operating system and other files are once again loaded into RAM, usually from your hard disk. 

Read-only memory (ROM): "Built-in" computer memory containing data that normally can only be read, not written to. ROM contains the programming that allows your computer to be "booted up" or regenerated each time you turn it on. Unlike a computer's random access memory (RAM), the data in ROM is not lost when the computer power is turned off. The ROM is sustained by a small long-life battery in your computer. 

Real-time clock (RTC): Is a battery-powered clock that is included in a microchip in a computer motherboard. This microchip is usually separate from the microprocessor and other chips and is often referred to simply as "the CMOS" (complementary metal-oxide semiconductor). A small memory on this microchip stores system description or setup values - including current time values stored by the real-time clock. The time values are for the year, month, date, hours, minutes, and seconds. When the computer is turned on, the Basic Input-Output Operating System (BIOS) that is stored in the computer's read-only memory (ROM) microchip reads the current time from the memory in the chip with the real-time clock.

Reconfiguration: Upgrading an existing product by replacing subsystems, peripherals, software or cabling.

Reflow: A process to form a solder joint by providing heat to the solder paste.

Reliability and failure analysis: Capability to determine the root cause of a component or assembly defect or failure as well as to predict the "life" of a board or system. This is usually expressed in terms of "mean time between failures" (MTBF).

Repair and maintenance: Repair, refurbishment, remanufacturing, upgrades, test and burn-in, component debug, field ready pack out, direct ship, RMA control, advanced exchange, DGI management, EC management, data recovery, failure analysis, material recovery.

Request for quote (RFQ): A document that is prepared by the OEM and submitted to the EMS provider for quotation. It typically includes product specifications and quantities, in addition to an AVL and BOM. The RFQ should also include key elements the OEM will request of the contract manufacturer in the MSA, such as inventory liabilities.

Returns processing: Receiving/parts ID, warranty validation, variance resolution, NTF screen, re-box/re-stock, route to repair/upgrade, scrap/re-cycle.

RISC: Pronounced risk, acronym for reduced instruction set computer, a type of microprocessor that recognizes a relatively limited number of instructions. Until the mid-1980s, the tendency among computer manufacturers was to build increasingly complex CPUs that had ever-larger sets of instructions. At that time, however, a number of computer manufacturers decided to reverse this trend by building CPUs capable of executing only a very limited set of instructions. One advantage of reduced instruction set computers is that they can execute their instructions very fast because the instructions are so simple. Another, perhaps more important advantage, is that RISC chips require fewer transistors, which makes them cheaper to design and produce.

RSA Algorithm: The RSA algorithm is named after Ron Rivest, Adi Shamir and Len Adleman, who invented it in 1977. The basic technique was first discovered in 1973 by Clifford Cocks of CESG (part of the British GCHQ) but this was a secret until 1997.The RSA algorithm can be used for both public key encryption and digital signatures. Its security is based on the difficulty of factoring large integers. For more information go to: http://www.di-mgt.com.au/rsa_alg.html . Shera does not have an affiliation with this site or company and merely offers the link as an information reference.  

SHA-1: This Standard specifies a Secure Hash Algorithm for computing a condensed representation of a message or a data file. When a message of any length < 264 bits is input, the SHA-1 produces a 160-bit output called a message digest. The message digest can then be input to the Digital Signature Algorithm (DSA) which generates or verifies the signature for the message. Signing the message digest rather than the message often improves the efficiency of the process because the message digest is usually much smaller in size than the message. The same hash algorithm must be used by the verifier of a digital signature as was used by the creator of the digital signature.

RS232: (3-wire, full-duplex, single-ended, 50ft cable limit) was developed in the 1960s, and among other things, specified an electrical standard, a protocol standard, handshaking, and connector pin-out. In general, many current applications for RS232 use only the electrical standard (3-wires, TDX, RXD, Common) and connector pin-out. While handshaking is still with us, it is usually best to disable it in software (if possible) and/or "loop-back" the pairs of signals (RTS to CTS, DTR to DSR, etc.) While RS232 was rumored to be on the "way out" with the advent of many of the new communications standards, it is still alive and well today. While the standard only supports low data rates and short line length (50ft.) it is still widely used and, very useful in many applications. With an external converters (RS232<=>RS485) many of the limitations of RS232 can be improved, to take advantage of, the superior properties of differential communications (2-wire or 4-wire).

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S

SIM (Subscriber Identification Module): SIM cards are small smart cards that fit inside phones based on the GSM technology. SIMs contain personalized information about its user including the network activation and even phone book entries. One can put its SIM card in another GSM phone and use it as if it was his own phone.

Single In-Line Memory Module (SIMM): A small circuit board that holds memory chips. A single in-line memory module (SIMM) has a 32-bit path to the memory chips

Small Outline Dual In-Line Memory Module (SO-DIMM): A small version of a DIMM used commonly in notebook computers. Whereas a full-size DIMM has 168 pins and can support 64-bit transfers, and SO DIMM has only 72 pins and can support only 32-bit transfers. In this respect, it is more like a SIMM, except that it is smaller.

Small-Outline J-lead (SOJ): A type of chip module that uses J-shaped pins that extend inwards. Unlike DIPs, which plug into holes on the circuit board, an SOJ chip attaches directly to the circuit board's surface.

Solder Mask: A coating applied over selected areas of a circuit board thereby permitting soldering only of the exposed (uncoated) areas, usually only the pads.

Static Random Access Memory (SRAM): A type of memory that is faster and more reliable than the more common DRAM (dynamic RAM). The term static is derived from the fact that it doesn't need to be refreshed like dynamic RAM.

StrongARM processors: CPU architecture oriented to embedded low end requirements originally designed by ARM (a UK based company) but now manufactured under license by Intel and some others.

Supply-chain management (SCM): Supply-chain management is the ability to ensure a steady flow of materials through the manufacturing process. Logistics management involves the sorting, warehousing, and shipping raw goods and finished products.

Surface Mount Technology (SMT): A method of soldering electrical components directly to a board substrate that uses less space than the pin-through-hole method. The components are mounted on the surface of a circuit board rather than inserting components into plated through holes.

Synchronous Dynamic Random Access Memory (SDRAM): A new type of DRAM that can run at much higher clock speeds than conventional memory. SDRAM actually synchronizes itself with the CPU's bus and is capable of running at 100 MHz, about three times faster than conventional FPM RAM, and about twice as fast as EDO DRAM and BEDO DRAM. SDRAM is replacing EDO DRAM in many newer computers.

Synchronous key encryption:  Data encryption using two interlocking keys where enything encoded using one key may be decoded using the other key. This means if someone makes one of the two keys publicly available (as in public-key encryption) and keeps the other private, then anyone may send them a message or data that only they can decode, giving privacy, and furthermore, the sender may also encrypt that same message additionally with their own private key, making it impossible to read without decoding first with *their* _public_ key by the receiver, this gives authenticity. It is a very powerful system. One cannot determine one key from the other, nor can they crack the encryption by computing all combinations, because, depending on the size of the keys (sometimes as large as 1024 bytes, though having grown from smaller versions in popular implementations of the software which does this), the amount of computing power required to crack the code is unavailable, even supercomputers would take more than a hundred years to crack it.

System-on-Chip (SoC): SoC technology is the packaging of all the necessary electronic circuits and parts for a "system" (such as a cell phone or digital camera) on a single integrated circuit (IC), generally known as a microchip. For example, a system-on-a-chip for a sound-detecting device might include an audio receiver, an analog-to-digital converter (ADC), a microprocessor, necessary memory, and the input/output logic control for a user - all on a single microchip.

Systems design: Ability to do designs that comprise the interaction and integration of various sub-assemblies into a single assembly to accomplish an intended function. The sub-assemblies can consist of electrical, mechanical, optical, software, acoustical and other components to achieve overall functionality. Examples of systems design include designing a PC, a cellular phone or a pager.

Systems integration: Combining sub-systems and/or peripherals, adding software and cabling to specification in order to produce fully configured product.


T

Test development: Ability to design and deploy a specific type of test. The test could be for functionality, manufacturability, reliability or qualification.

Test Strategy: Ability to design a test using the most cost-effective test techniques to ensure the item being tested functions correctly.

Testing: Providing ways to check the functionality of components, sub-assemblies, assemblies and/or a finished product. Tests can include: in-circuit tests, functional tests and systems tests

TDMA (Time Division Multiple Access): One of the oldest digital cellular technology, mostly seen in North America. It is considered the less advanced digital technology, partly because of its lack of flexibility compared to other digital cellular technologies. TDMA divides communications into packets of data based on timed transmission.

Time to market: The length of time it takes to get a quality product into the marketplace. Faster time to market is a critical business objective for all manufacturers. Companies in every industry are using speed as a competitive weapon. The goal is to get to market with a new product (or a better quality product) quicker than anyone else. Being the first to market can increase a company’s profit margin and its market share.

Time to volume: The length of time it takes to bring a product from prototype or first article to a high-volume production mode.

Triple DES (3DES): Triple DES is a minor variation of the DES standard. It is three times slower than regular DES but can be billions of times more secure if used properly.  It takes three 64-bit keys, for an overall key length of 192 bits. In Private Encryptor, you simply type in the entire 192-bit (24 character) key rather than entering each of the three keys individually. The Triple DES DLL then breaks the user provided key into three subkeys, padding the keys if necessary so they are each 64 bits long. The procedure for encryption is exactly the same as regular DES, but it is repeated three times. Hence the name Triple DES. The data is encrypted with the first key, decrypted with the second key, and finally encrypted again with the third key.

Turnkey: A type of outsourcing method that turns over to the subcontractor all aspects of manufacturing including material acquisition, assembly and testing. Its opposite is consignment, where the outsourcing company provides all materials required for the products and the subcontractor provides only assembly equipment and labor.

U

Universal Asynchronous Receiver/Transmitter(UART): The microchip with programming that controls a computer's interface to its attached serial devices. Specifically, it provides the computer with the RS-232C Data Terminal Equipment (DTE) interface so that it can "talk" to and exchange data with modems and other serial devices.

USB On-The-Go (OTG): Is a supplement standard to the USB specification that enables point-to-point communication among portable devices. With USB OTG on board, a digital still camera (DSC) can connect directly to a photo printer, a PDA can connect directly to a keyboard or a mobile phone, and an MP3 player can connect directly to a hard disk drive.


V

Vendor-managed inventory (VMI): A process in which a supplier owns components until they are issued or released to the production line. Usually, VMI is handled by a distributor located within a plant.

Volume price agreement (VPA): A contract service agreement containing pricing, deliverables and cost reductions based on volume manufacturing.


W

White box: Build a unit of our own design with an end customer’s "label" (e.g. VAR/reseller) to an individual order, including required peripherals and software. Ships direct to the customer